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Description
MAIN FEATURES
- Lightweight design
- Modular architecture
- Customizable solutions
APPLICATIONS
- AESA radar antenna panels
PRODUCT INTRODUCTION
This product is a four-channel transmit/receive (T/R) chipset in the X-band microwave SiP series, developed using advanced hybrid integration technology that integrates a phase-and-amplitude multifunction chip and RF transceiver chips into a single package.
The module typically consists of one phase-and-amplitude multifunction chip and four RF transceiver chips, enabling beam control, power amplification, and microwave reception functions.
The chipset integrates the following circuit modules: digitally controlled phase shifters, attenuators, transmit driver amplifiers, receive low-noise amplifiers, power dividers, switching circuits, and serial-to-parallel drivers.
This microwave SiP chip series is developed using advanced hybrid integration technology, integrating beamforming chips and RF transceiver chips into a single package. Typically, one beamforming chip and four RF transceiver chips are integrated to form a complete transmit/receive chipset, enabling beam control, power amplification, and microwave reception functions. The series is designed for two-dimensional active phased array antennas.
SPECIFICATIONS
DIAGRAM
T/R Module Series Comparison
